Surface analysis with X-ray photoelectron spectroscopy (XPS) – Precise chemistry down to the nanometer range High-resolution, non-destructive surface and depth analysis for metallic, semiconducting, and oxide materials – ideal for quality assurance, material development, and failure analysis. The IFW Dresden offers X-ray photoelectron spectroscopy (XPS), a surface-sensitive chemical analysis with a penetration depth of up to 10 nm. This method allows for precise determination of elemental composition and chemical bonding states, including depth profiles down to 500 nm through repeated sputtering. The offering is complemented by non-destructive analysis of layer structures using angle-dependent XPS and valence state analysis. Metallic or organic thin films can also be prepared directly on-site under ultra-high vacuum conditions. Your benefits Highest surface sensitivity up to 10 nm Detailed chemical bond analysis Depth profiles up to 500 nm Non-destructive layer analysis using angle-dependent XPS Thin film preparation in UHV directly before analysis Suitable for complex material systems (metals, semiconductors, oxides) Methods & Equipment XPS PHI 5600-CI with 150 mm hemispherical analyzer Multi-channel detector (16 channels) Monochromatic Al Kα source, switchable to Al/Mg anodes Valence state analysis with helium gas discharge lamp Samples up to 20 mm Ø, 10 mm thick; pellets, thin films, powder Fields of application Quality control of surfaces and coatings Analysis of natural oxide layers and corrosion products Characterization of thin-film systems Troubleshooting layer adhesion and material failure Development and optimization of functional interfaces

Individual calibration gases according to standards – precise, reproducible and traceable to SI units for your measurement and testing applications. Using the DIGAMIX 6KM 501 gas mixing pump from Wösthoff Messtechnik, IFW Dresden produces calibration gases according to DIN EN ISO 51898 and ISO 6145-2 using the absolute volumetric method. The mixture is determined exclusively by stroke volume and stroke rate – regardless of the gases being mixed – and homogenized in specially designed mixing vessels. This makes the produced mixtures directly traceable to SI units. We produce 2- or 4-component gas mixtures in variable mixing ratios with concentrations down to the ppm range, ideal for high-precision calibration and testing applications. Your benefits Standardized production according to DIN EN ISO 51898 / ISO 6145-2 High precision through absolute volumetric method Flexibility for 2- and 4-component mixtures Concentrations down to the ppm range Documented mixing process with logging via diagnostic interface Methods & Equipment DIGAMIX 6KM 501 gas mixing pump Nominal flow rate: approx. 65 l/h 2-component mixtures: 0–100% in 1% steps 4-component mixtures: differentiated setting ranges (up to 10% in 1% steps, up to 100% in 10% steps) Logging: stroke rate, stroke rate reduction, setpoint estimation according to DIN 51898-1 Fields of application Calibration of gas sensors and measuring devices Quality assurance in process and environmental measurement technology Test gases for research and development Simulation of specific gas atmospheres for material tests

Precise analysis of the outgassing behavior of your materials under the influence of high vacuum and temperature – for clean processes and reliable components in demanding applications. The IFW Dresden offers the investigation of the outgassing behavior of materials in a 10-liter UHV chamber with a mass spectrometer connection. Starting at a pressure of 1 × 10⁻⁵ mbar, gas molecules can be detected and clearly assigned to the sample material by comparison with the known basic chamber spectrum. The heatable sample holder allows the outgassing behavior to be analyzed even at defined temperatures up to 450 °C – ideal for material qualification in vacuum technology, semiconductor production, aerospace, and precision manufacturing. Your benefits Detailed residual gas analysis up to mass number 200 High vacuum conditions up to 8 × 10⁻⁸ mbar Temperature-controlled measurements for practical simulation Fast sample loading via 100 mm quick-release door Reliable difference analysis through known chamber fundamental spectrum Methods & Equipment UHV chamber volume: 10 l Final pressure: approx. 8 × 10⁻⁸ mbar (without lock chamber) Mass spectrometer: Analysis up to mass number 200 Heatable sample holder (55 × 55 mm) Temperature control: continuously variable up to 450 °C Fields of application Qualification of materials for vacuum and cleanroom applications Selection of suitable materials for high vacuum processes Analysis of impurities and sources of contamination Optimization of components for semiconductor, optics, and aerospace technology

Maximum dimensional accuracy, complex contours and fine surfaces – precise EDM machining for components where conventional machining reaches its limits. IFW Dresden offers high-precision wire EDM and die-sinking EDM for machining electrically conductive materials. Using state-of-the-art Agie-Charmilles technology, we create complex contours, fine cutouts, and precise fits – regardless of the material's hardness. Our wire EDM process enables conical cutting up to 45° and machining with an integrated rotary axis, while die-sinking EDM creates the finest contours and undercuts. Ideal for tools, prototypes, functional components, and small series production with the highest quality standards. Your benefits Precise contour accuracy even with complex geometries Material-independent hardening Finest spark gap sizes for delicate details Machining of conical shapes up to 45° Use of state-of-the-art Agie-Charmilles systems Methods & Equipment Wire EDM – Agie Charmilles FI 440 ccS Working area: 550 × 350 × 400 mm Conical cutting up to 45° Cutting width: approx. 0.3 mm (depending on material) Built-in rotation axis EDM sinking – Agie Charmilles Roboform 350 Working area: 600 × 500 × 300 mm Spark gap size: 20 µm – 2 mm Gate countersinking up to 45° Fields of application Tool and mold making Manufacturing high-precision prototypes Machining hardened steels or difficult-to-machine alloys Contour-accurate components with delicate details and tight tolerances

From micro-drilling to complex 5-axis machining – we manufacture your components precisely, efficiently, and with CAD/CAM support. IFW Dresden offers high-precision manufacturing of small and complex components using state-of-the-art milling technologies. Our range of services includes micro-milling , micro-drilling , thread milling , and 3- and 5-axis machining with direct CAD/CAM integration for maximum production efficiency. Whether prototypes, functionally critical individual parts, or small series – we provide technical advice and precisely implement your design specifications. For processing, we only require your drawing in DXF format. Your benefits Extremely high manufacturing precision even with complex geometries Flexible machining processes for small series and prototypes Direct CAD-CAM connection for fast, error-free implementation Technical advice from feasibility study to final processing Diverse material processing from metals to high-performance plastics Methods & Equipment 5-axis milling machine MIKRON HSM 200U LP : Working area 100 × 100 × 100 mm 5-axis milling machine Hermle C600 U (CAD-CAM) : Working area 300 × 300 × 300 mm 3-axis milling machine EMCOMAT FB 600MC (CAD-CAM) : Working area 600 × 300 × 600 mm Fields of application Precision components for mechanical engineering, medical technology and electronics Tool inserts and prototypes with tight tolerances Functional models for research and development Small series production with high surface requirements

Fast, precise, and versatile: Additive manufacturing of prototypes, functional parts, and complex geometries with the Stratasys F170. The IFW Dresden manufactures components using the FDM (Fused Deposition Modeling) process from the thermoplastics ABS, PLA, and UV-stable ASA – ideal for functional prototypes, technical components, and test geometries. For complex shapes, we use soluble support material, which is removed after printing in a temperature-controlled lye bath. Drill holes, internal threads, or fused-in metal thread inserts can be integrated during post-processing. ABS and ASA are available in various colors for visual customization. We also support the creation of 3D models and, if necessary, procure components made of special materials through external partners. Your benefits Fast implementation of functional prototypes and small series Complex geometries can be realized with soluble support material Post-processing & functionalization directly on site Support in the design process and material selection Color variants available for ABS and ASA Methods & Equipment Stratasys F170 3D printer Max. model size: 254 × 254 × 254 mm Minimum wall thickness: approx. 0.7 mm Layer thicknesses (depending on material): 0.1270 mm / 0.1778 mm / 0.2540 mm / 0.3302 mm Accuracy: ± 0.2 mm or ± 0.002 mm per mm File formats: preferably SLDPRT, STL, STEP, IGES (others on request) Fields of application Functional prototypes for mechanical and electronic development Fixtures, brackets and assembly aids Test samples for fit and ergonomics tests Manufacturing complex geometries for research projects

From high-speed imaging to 3D scanning – precise measurement data for development, quality assurance and research The IFW Dresden offers a wide range of measurement and calibration services for industrial and scientific applications. Our equipment includes high-speed cameras for ultrafast process analyses, precise magnetic field, EMC, and acoustic measurements, as well as tactile and optical 3D measurement systems for component and geometry testing. Specialized sensors and analysis methods enable real-time data acquisition, long-term analyses, and comprehensive reporting – individually tailored to your requirements. Your benefits Wide measurement spectrum of mechanical, acoustic and electromagnetic quantities High-precision 3D measurement technology for geometry and surface inspection Real-time data acquisition and long-term analyses Individual measurement strategies for special components Complete service from planning to reporting Methods & Equipment High-speed camera FASTCAM SA3 : up to 120,000 fps (128×16 px), 2,000 fps at 1024×1024 px Building vibration measurement : highly sensitive acceleration sensors (1000 mV/g) Magnetic field measurement : 100 nT-100 mT, RMS AC/DC, DC-400 kHz, FFT/CPB analysis, hand-held Teslameter up to 2.5 T EMC measurement : 9 kHz–8 GHz, emission/immission, RF attenuation, design recommendations Acoustic measurement : 10–16,000 Hz, FFT, digital filtering, noise floor ~5.5 dB(A) 3D scanner : measuring depth ±50 mm, measuring volume 6.3 m³ OGP measuring microscopy : motorized 5:1 zoom lens, measuring range 250×150×150 mm Tactile measuring arm (FaroArm) : Accuracy 0.018 mm, working range Ø 0.6–1.2 m Fields of application Process analysis & error diagnosis Quality control of complex components EMC & magnetic field safety tests Sound power measurements of systems Dynamic movement and vibration analyses

From the idea to the finished circuit board – fast and precise implementation of two-layer through-hole SMD layouts in-house. The IFW Dresden manufactures two-layer, through-hole plated printed circuit boards with structure widths up to 100 µm for prototypes and small series. Depending on the requirements, structuring is carried out either using precise milling or conventional wet-chemical methods with direct exposure or film processes. Chemical tin finishes and solder masking are just as possible as full through-hole plating. Our infrastructure covers the entire process – from layout processing to exposure, etching, and drilling to final processing – for fast, flexible, and precise implementation. Your benefits Complete in-house production from design to finished circuit board Finest structure widths down to 100 µm reproducible Flexible processes (milling or wet-chemical) for different requirements High precision for research, development and functional prototypes Individual adjustment of layout, finish and masking Methods Direct exposure (LIMATA UV-P50): Resolution ±1 µm (step size), reproducibility ±10 µm, up to 300×400 mm Milling (Isel FlatCom M20): Repeatability ±20 µm, material thickness 0.1–10 mm Etching (S30 Stripper): Spray development, spray etching, neutralization, rinsing, drying Through-hole plating (Bungard Compakta 40 2CU): up to 300×400 mm, galvanic Circuit board plotter (ProtoMat H100): Resolution 0.25 µm, repeatability ±1 µm Fields of application Functional prototypes for electronics development Test boards for new components and sensors Printed circuit boards for small series in research and development Manufacturing special circuits for laboratory experiments

See what other methods leave hidden – with high-resolution electron microscopy and customized analysis packages at the IFW Dresden. The IFW Dresden offers comprehensive electron microscopy services (SEM & TEM) for high-resolution structural analysis of a wide variety of materials. Our equipment enables not only conventional imaging but also combined analyses using energy-dispersive X-ray spectroscopy (EDXS) and electron energy loss spectroscopy (EELS/ELNES). In situ experiments provide additional insights into dynamic structural changes under real-world conditions. Through in-house sample preparation – including thin-film deposition – we handle complete material analysis from a single source. Your benefits Imaging down to the sub-nanometer range Combined structural and chemical analysis for precise material characterization In-situ experiments under realistic operating conditions Complete on-site sample preparation for fast results Wide range of materials from metals to ceramics to nanostructures Methods Scanning electron microscopy (SEM) and transmission electron microscopy (TEM) EDXS for elemental analysis EELS/ELNES for electronic structure investigations In-situ heating and loading experiments Thin film deposition and preparation for material and multilayers Fields of application Quality control and damage analysis Development and optimization of functional layers Characterization of nanostructures (e.g. graphene, CNTs) Analysis of multilayer systems with special magnetic or electronic properties Investigation of thin protective and functional layers

From delicate engravings to durable welds – we implement your requirements with industrial laser precision. At IFW Dresden, we offer versatile laser processing for metallic and selected non-metallic materials. Whether laser welding for functionally critical joints, precise cutting of thin sheets, or engraving for functionalization and marking – we provide personalized advice on material and process selection. Our systems enable the production of prototypes, small series, and special components with high dimensional accuracy. Special materials can be tested upon request. Your benefits Three laser processes under one roof: welding, cutting, engraving Tailor-made advice for material & application High precision for small and medium batch sizes Flexibility for different geometries & materials Confidential project implementation for industrial developments Methods Laser welding (Alpha Laser ALW200): 200 W, closed cell, working area 550×600×300 mm Laser cutting (ACSYS PIRANHA CUT): max. 340×340 mm, stainless steel/aluminum up to 2 mm, bronze/copper up to 1 mm Laser engraving (SK Laser Kolltronic©): Writing field 110×110 mm, components up to 350×350×350 mm Fields of application Manufacture and repair of delicate metal components Precision cutting for prototypes and functional models Engraving of functional markings, QR codes or logos Small-scale production and material processing for research and development

Identify, quantify, and understand reactive oxygen species – precisely and reliably with state-of-the-art ESR/EPR analysis. Reactive oxygen species (ROS) – from singlet oxygen to hydroxyl and superoxide radicals – play a crucial role in many industrial processes, materials, and biological systems. At the IFW Dresden, we detect and identify these highly reactive species using electron spin or electron paramagnetic resonance spectroscopy (ESR/EPR). Our analyses enable the precise determination of ROS in solutions or organic matrices and provide quantitative concentration data – a crucial building block for product development, quality control, and process optimization. Your benefits Reliable identification of ROS such as O₂, ●OH, ●OOH, O₂●⁻ Quantitative concentration determination for precise process control Detection of organic radicals in complex systems Wide range of applications from materials science to biotechnology Fast & confidential analyses for research and industry Methods Electron spin (paramagnetic) resonance spectroscopy (ESR/EPR) Analysis in liquids and organic solids Detection of ROS and organic radicals in situ Fields of application Development of antioxidant materials and coatings Monitoring of oxidative processes in chemical and pharmaceutical production Quality control in polymer and food technology Research on aging and degradation processes in materials Biotechnological applications with ROS detection

From powder to high-performance component in minutes – with precise, energy-efficient compaction of sensitive and innovative materials. At IFW Dresden, we use state-of-the-art FAST/SPS (Field Assisted Sintering / Spark Plasma Sintering) technology to densify powder materials quickly and uniformly. We specialize in thermoelectric and topological nanopowders, as well as complex composites. Through simultaneous electric heating and uniaxial pressing force, we achieve homogeneous volume heating and densification without pre-pressing the powder. Our equipment allows for the safe processing of sensitive materials under inert gas or vacuum – ideal for prototypes, functional models, and small series. Your benefits Extremely short processing times with high material quality Gentle densification of sensitive nanostructures High flexibility in powder types and geometries Processing under protective gas/vacuum for reactive materials Direct tool filling – no pre-compaction required Methods AGUS-PECS SPS-210Gx (with glove box); Press force: 0.5–20 kN; Temperature: up to 2500 °C Atmospheres: Argon, vacuum, high vacuum Graphite pressing tools up to 2200 °C/50 MPa or high-strength up to 2500 °C/90 MPa Tool diameter: 4, 5, 10, 15 mm CT Sintering Plant KCE-FCT H-HP D25-5D/FL : up to 250 kN, 100 kW hybrid heating, up to 2200 °C, Ar/N₂/vacuum, Ø 10–80 mm, up to 200 MPa Fields of application Development of high-density functional and structural materials Thermoelectrics & energy conversion components Topological and magnetic high-performance materials Prototype production for demanding applications