Surface analysis with X-ray photoelectron spectroscopy (XPS) – Precise chemistry down to the nanometer range





High-resolution, non-destructive surface and depth analysis for metallic, semiconducting, and oxide materials – ideal for quality assurance, material development, and failure analysis.







The IFW Dresden offers X-ray photoelectron spectroscopy (XPS), a surface-sensitive chemical analysis with a penetration depth of up to 10 nm. This method allows for precise determination of elemental composition and chemical bonding states, including depth profiles down to 500 nm through repeated sputtering. The offering is complemented by non-destructive analysis of layer structures using angle-dependent XPS and valence state analysis. Metallic or organic thin films can also be prepared directly on-site under ultra-high vacuum conditions.







Your benefits

• Highest surface sensitivity up to 10 nm

• Detailed chemical bond analysis

• Depth profiles up to 500 nm

• Non-destructive layer analysis using angle-dependent XPS

• Thin film preparation in UHV directly before analysis

• Suitable for complex material systems (metals, semiconductors, oxides)





Methods & Equipment



• XPS PHI 5600-CI with 150 mm hemispherical analyzer

• Multi-channel detector (16 channels)

• Monochromatic Al Kα source, switchable to Al/Mg anodes

• Valence state analysis with helium gas discharge lamp

• Samples up to 20 mm Ø, 10 mm thick; pellets, thin films, powder



Fields of application



• Quality control of surfaces and coatings

• Analysis of natural oxide layers and corrosion products

• Characterization of thin-film systems

• Troubleshooting layer adhesion and material failure

• Development and optimization of functional interfaces