Surface analysis with X-ray photoelectron spectroscopy (XPS) – Precise chemistry down to the nanometer range High-resolution, non-destructive surface and depth analysis for metallic, semiconducting, and oxide materials – ideal for quality assurance, material development, and failure analysis. The IFW Dresden offers X-ray photoelectron spectroscopy (XPS), a surface-sensitive chemical analysis with a penetration depth of up to 10 nm. This method allows for precise determination of elemental composition and chemical bonding states, including depth profiles down to 500 nm through repeated sputtering. The offering is complemented by non-destructive analysis of layer structures using angle-dependent XPS and valence state analysis. Metallic or organic thin films can also be prepared directly on-site under ultra-high vacuum conditions. Your benefits Highest surface sensitivity up to 10 nm Detailed chemical bond analysis Depth profiles up to 500 nm Non-destructive layer analysis using angle-dependent XPS Thin film preparation in UHV directly before analysis Suitable for complex material systems (metals, semiconductors, oxides) Methods & Equipment XPS PHI 5600-CI with 150 mm hemispherical analyzer Multi-channel detector (16 channels) Monochromatic Al Kα source, switchable to Al/Mg anodes Valence state analysis with helium gas discharge lamp Samples up to 20 mm Ø, 10 mm thick; pellets, thin films, powder Fields of application Quality control of surfaces and coatings Analysis of natural oxide layers and corrosion products Characterization of thin-film systems Troubleshooting layer adhesion and material failure Development and optimization of functional interfaces

Individual calibration gases according to standards – precise, reproducible and traceable to SI units for your measurement and testing applications. Using the DIGAMIX 6KM 501 gas mixing pump from Wösthoff Messtechnik, IFW Dresden produces calibration gases according to DIN EN ISO 51898 and ISO 6145-2 using the absolute volumetric method. The mixture is determined exclusively by stroke volume and stroke rate – regardless of the gases being mixed – and homogenized in specially designed mixing vessels. This makes the produced mixtures directly traceable to SI units. We produce 2- or 4-component gas mixtures in variable mixing ratios with concentrations down to the ppm range, ideal for high-precision calibration and testing applications. Your benefits Standardized production according to DIN EN ISO 51898 / ISO 6145-2 High precision through absolute volumetric method Flexibility for 2- and 4-component mixtures Concentrations down to the ppm range Documented mixing process with logging via diagnostic interface Methods & Equipment DIGAMIX 6KM 501 gas mixing pump Nominal flow rate: approx. 65 l/h 2-component mixtures: 0–100% in 1% steps 4-component mixtures: differentiated setting ranges (up to 10% in 1% steps, up to 100% in 10% steps) Logging: stroke rate, stroke rate reduction, setpoint estimation according to DIN 51898-1 Fields of application Calibration of gas sensors and measuring devices Quality assurance in process and environmental measurement technology Test gases for research and development Simulation of specific gas atmospheres for material tests

Precise analysis of the outgassing behavior of your materials under the influence of high vacuum and temperature – for clean processes and reliable components in demanding applications. The IFW Dresden offers the investigation of the outgassing behavior of materials in a 10-liter UHV chamber with a mass spectrometer connection. Starting at a pressure of 1 × 10⁻⁵ mbar, gas molecules can be detected and clearly assigned to the sample material by comparison with the known basic chamber spectrum. The heatable sample holder allows the outgassing behavior to be analyzed even at defined temperatures up to 450 °C – ideal for material qualification in vacuum technology, semiconductor production, aerospace, and precision manufacturing. Your benefits Detailed residual gas analysis up to mass number 200 High vacuum conditions up to 8 × 10⁻⁸ mbar Temperature-controlled measurements for practical simulation Fast sample loading via 100 mm quick-release door Reliable difference analysis through known chamber fundamental spectrum Methods & Equipment UHV chamber volume: 10 l Final pressure: approx. 8 × 10⁻⁸ mbar (without lock chamber) Mass spectrometer: Analysis up to mass number 200 Heatable sample holder (55 × 55 mm) Temperature control: continuously variable up to 450 °C Fields of application Qualification of materials for vacuum and cleanroom applications Selection of suitable materials for high vacuum processes Analysis of impurities and sources of contamination Optimization of components for semiconductor, optics, and aerospace technology